forge1
1. Overview
RK3506J is a high-performance three core Cortex-A7 application processor designed for intelligent voice interaction, audio input/output processing, image output processing, and other digital multimedia applications. Embedded 2D hardware engine and display output engine, used to minimize CPU overhead to meet image display requirements. Embedding rich peripheral interfaces such as SAI, PDM, SPDIF, Audio DSM, Audio ADC, USB2 OTG, RMII, CAN, etc., can meet different application development needs, reduce hardware development complexity and development costs.
使用手册
Forge User Manual
How to start using your Forge
Hardware Information
Hardware Interfaces
Hardware Specifications
ArmSom-Forge1 Hardware Specifications
Category | Functional Parameters |
---|---|
SOC | |
CPU | |
GPU | |
Memory | |
Storage | |
Network | |
Video Output | |
Audio | |
USB Interface | |
40-PIN | |
Power | |
Buttons | |
System | |
Size | |
Operating Temperature |
RK3506 Block Diagram
Pin Definitions
40-PIN Socket
GPIO Number | Function | Pin | Pin | Function | GPIO Number |
---|---|---|---|---|---|
+3.3V | 1 | 2 | +5.0V | ||
130 | I2C1_SDA_M0 / UART3_RTSN / I2S1_SDI3 / GPIO4_A2_d / | 3 | 4 | +5.0V | |
131 | I2C1_SCL_M0 / UART3_CTSN / I2S1_SDI2 / GPIO4_A3_d | 5 | 6 | GND | |
1 | REF_CLK_OUT_M0 /GPIO0_A1 | 7 | 8 | UART0_TX_M0 / JTAG_MCU_TCK_M1 / JTAG_CPU_TCK_M1 / GPIO4_D0_d | 152 |
GND | 9 | 10 | UART0_RX_M0 / JTAG_MCU_TMS_M1 / JTAG_CPU_TMS_M1 / GPIO4_C7_u | 151 | |
0 | GPIO0_A0 | 11 | 12 | I2S1_SCLK / UART1_RTSN / GPIO4_A5_d | 133 |
13 | 14 | GND | |||
15 | 16 | ||||
+3.3V | 17 | 18 | |||
138 | SPI0_MOSI / PDM_SDI0 / I2S1_SDO3 / GPIO4_B2_d | 19 | 20 | GND | |
139 | SPI0_MISO / PDM_SDI2 / I2S1_SDI1 / GPIO4_B3_d | 21 | 22 | ||
140 | SPI0_CLK / I2S1_SDI0 / GPIO4_B4_d | 23 | 24 | SPI0_CSN0 / PWR_CTRL1 / GPIO4_B6_u | 142 |
GND | 25 | 26 | PWM6_M0 / SPI0_CSN1 / PDM_SDI3 / GPIO4_C1_d | 145 | |
147 | I2C0_SDA_M0 / PWM0_M0 / GPU_AVS / GPIO4_C3_d | 27 | 28 | ARM_AVS / PWM1_M0 / I2C0_SCL_M0 / GPIO4_C4_d | 148 |
29 | 30 | GND | |||
31 | 32 | GPIO4_C0/PWM5_M0 / FEPHY_LED_LINK_M0 / UART3_TX_M1 | 144 | ||
143 | GPIO4_B7 / PWM4_M0 / FEPHY_LED_SPD_M0 / UART3_RX_M1 | 33 | 34 | GND | |
134 | UART1_TX_M0 / I2S1_LRCK / GPIO4_A6_d | 35 | 36 | ||
37 | 38 | GPIO3_B2 / SPI0_CLK / I2S1_SDI0 | 106 | ||
GND | 39 | 40 | GPIO4_A7_d / UART1_RX_M0 / I2S1_SDO0 | 135 |
Development Materials
SDK Source Code
Official Images
The ArmSoM team uses buildroot bullseye as the official operating system.
The following systems have been tested and verified by ArmSoM officially:
Hardware Documentation
Obtain the schematic diagrams, DXF, and other hardware documentation for forge1.
Product Certificates
Supply Statement
The ArmSoM-Sige1 will be produced at least until August 2034.
Accessories
The official accessories designed for the ArmSoM-Sige are intended to help you achieve optimal performance from your computer.
Purchase Samples
ArmSoM Official Website: https://www.armsom.org/product-page/Sige1
ArmSoM Official AliExpress Store: https://aliexpress.com/item/3256807356692995.html
ArmSoM Official Taobao Store: https://item.taobao.com/item.htm?id=824590173298
For OEM & ODM, please contact: sales@armsom.org
Notes
- Before handling the device, please ensure you wear an anti-static wrist strap or take electrostatic discharge measures to prevent damage to the development board.
- Assembly should be performed in an electrostatic-safe environment, avoiding operations in dry and low-humidity conditions.
- When not in use, store the device in an anti-static bag and keep it in a suitably temperature-controlled, low-humidity environment to prevent static electricity buildup.
- When handling the device, avoid friction or collisions to prevent the generation of static electricity that could cause damage.
- When holding the device, try to avoid direct contact with the chips on the mainboard to prevent static damage.
- Do not plug or unplug wires or other devices while the device is operating to avoid damage from electrical surges.
- When connecting or disconnecting the GPIO/MIPI expansion interfaces, make sure to turn off the power and disconnect the power cable to prevent damage from electrical current.
Without effective cooling measures, the surface temperature of the main chip may exceed 60 degrees. When handling the device, please avoid direct contact with the SoC and surrounding power inductors to prevent burns. Ensure that the environment is well-ventilated during operation to prevent localized heat buildup, which could lead to overheating. Additionally, do not place the device in direct sunlight. It is recommended to choose between the official cooling fan, heat sink, or third-party cooling kits based on specific usage conditions to ensure optimal cooling performance.