Перейти к основному содержимому

forge1

1. Overview

RK3506J is a high-performance three core Cortex-A7 application processor designed for intelligent voice interaction, audio input/output processing, image output processing, and other digital multimedia applications. Embedded 2D hardware engine and display output engine, used to minimize CPU overhead to meet image display requirements. Embedding rich peripheral interfaces such as SAI, PDM, SPDIF, Audio DSM, Audio ADC, USB2 OTG, RMII, CAN, etc., can meet different application development needs, reduce hardware development complexity and development costs.


使用手册

✈️

Forge User Manual

How to start using your Forge

Hardware Information

Hardware Interfaces

armsom-forge1-front-back

Hardware Specifications

ArmSom-Forge1 Hardware Specifications
CategoryFunctional Parameters
SOC
  • RockChip RK3506j
  • CPU
  • Three-core Cortex-A7 processor RK3506
  • GPU
  • 2D Graphic Engine
  • Embedded high-performance 2D acceleration hardware
  • Memory
  • 256MB/512MB/1GB DDR3/DDR3L 16bit
  • Storage
  • 256MB/512MB NAND
  • Supports MicroSD card expansion
  • Network
  • 2 × Gigabit Ethernet M bps)
  • Video Output
  • 1 x RGB (1280×1280@60fps)
  • 1 x MIPI_DSI_TX(2Lane 1.5Gbps)
  • Audio
  • 1 × Speaker 1 × MIC
  • USB Interface
  • 1 × USB2.0 OTG(Type C)
  • 1 × USB2.0 HOST
  • 40-PIN
  • Partially compatible with Raspberry Pi 40-pin, allowing connection to a variety of accessory peripherals
  • Supports UART/SPI/I2C/I2S/PWM/5V Power/3.3V Power
  • Power
  • 12V/2A
  • Buttons
  • 1x Maskrom key, supports entering maskrom burn-in mode
  • System
  • Officially supported by yocto buildroot
  • Size
  • 92 mm x 62mm
  • Operating Temperature
  • -40℃ ~ 85℃
  • RK3506 Block Diagram

    Pin Definitions

    40-PIN Socket
    GPIO NumberFunctionPinPinFunctionGPIO Number
    +3.3V
    1
    2
    +5.0V
    130I2C1_SDA_M0 / UART3_RTSN / I2S1_SDI3 / GPIO4_A2_d /
    3
    4
    +5.0V
    131I2C1_SCL_M0 / UART3_CTSN / I2S1_SDI2 / GPIO4_A3_d
    5
    6
    GND
    1REF_CLK_OUT_M0 /GPIO0_A1
    7
    8
    UART0_TX_M0
    / JTAG_MCU_TCK_M1 / JTAG_CPU_TCK_M1 / GPIO4_D0_d
    152
    GND
    9
    10
    UART0_RX_M0
    / JTAG_MCU_TMS_M1 / JTAG_CPU_TMS_M1 / GPIO4_C7_u
    151
    0GPIO0_A0
    11
    12
    I2S1_SCLK / UART1_RTSN / GPIO4_A5_d133
    13
    14
    GND
    15
    16
    +3.3V
    17
    18
    138SPI0_MOSI / PDM_SDI0 / I2S1_SDO3 / GPIO4_B2_d
    19
    20
    GND
    139SPI0_MISO / PDM_SDI2 / I2S1_SDI1 / GPIO4_B3_d
    21
    22
    140SPI0_CLK / I2S1_SDI0 / GPIO4_B4_d
    23
    24
    SPI0_CSN0 / PWR_CTRL1 / GPIO4_B6_u142
    GND
    25
    26
    PWM6_M0 / SPI0_CSN1 / PDM_SDI3 / GPIO4_C1_d145
    147I2C0_SDA_M0 / PWM0_M0 / GPU_AVS / GPIO4_C3_d
    27
    28
    ARM_AVS / PWM1_M0 / I2C0_SCL_M0 / GPIO4_C4_d148
    29
    30
    GND
    31
    32
    GPIO4_C0/PWM5_M0 / FEPHY_LED_LINK_M0 / UART3_TX_M1144
    143GPIO4_B7 / PWM4_M0 / FEPHY_LED_SPD_M0 / UART3_RX_M1
    33
    34
    GND
    134UART1_TX_M0 / I2S1_LRCK / GPIO4_A6_d
    35
    36
    37
    38
    GPIO3_B2 / SPI0_CLK / I2S1_SDI0106
    GND
    39
    40
    GPIO4_A7_d / UART1_RX_M0 / I2S1_SDO0135

    Development Materials

    SDK Source Code

    Official Images

    The ArmSoM team uses buildroot bullseye as the official operating system.

    The following systems have been tested and verified by ArmSoM officially:

    Hardware Documentation

    Obtain the schematic diagrams, DXF, and other hardware documentation for forge1.

    Product Certificates

    Supply Statement

    The ArmSoM-Sige1 will be produced at least until August 2034.

    Accessories

    The official accessories designed for the ArmSoM-Sige are intended to help you achieve optimal performance from your computer.

    0.8mm 连接器

    Purchase Samples

    ArmSoM Official Website: https://www.armsom.org/product-page/Sige1

    ArmSoM Official AliExpress Store: https://aliexpress.com/item/3256807356692995.html

    ArmSoM Official Taobao Store: https://item.taobao.com/item.htm?id=824590173298

    For OEM & ODM, please contact: sales@armsom.org

    Notes

    [Electrostatic Protection]
    1. Before handling the device, please ensure you wear an anti-static wrist strap or take electrostatic discharge measures to prevent damage to the development board.
    2. Assembly should be performed in an electrostatic-safe environment, avoiding operations in dry and low-humidity conditions.
    3. When not in use, store the device in an anti-static bag and keep it in a suitably temperature-controlled, low-humidity environment to prevent static electricity buildup.
    4. When handling the device, avoid friction or collisions to prevent the generation of static electricity that could cause damage.
    5. When holding the device, try to avoid direct contact with the chips on the mainboard to prevent static damage.
    6. Do not plug or unplug wires or other devices while the device is operating to avoid damage from electrical surges.
    7. When connecting or disconnecting the GPIO/MIPI expansion interfaces, make sure to turn off the power and disconnect the power cable to prevent damage from electrical current.
    [Heat Management]

    Without effective cooling measures, the surface temperature of the main chip may exceed 60 degrees. When handling the device, please avoid direct contact with the SoC and surrounding power inductors to prevent burns. Ensure that the environment is well-ventilated during operation to prevent localized heat buildup, which could lead to overheating. Additionally, do not place the device in direct sunlight. It is recommended to choose between the official cooling fan, heat sink, or third-party cooling kits based on specific usage conditions to ensure optimal cooling performance.